As noted by Mac Otakara, Japanese parts firm Moumantai has posted three photos of what may be the bare logic board from the iPhone 5S. Unsurprisingly, the shape of the board is nearly identical to that of the iPhone 5 logic board, although it appears to have a slightly different curve along the bottom edge where the logic board would meet the speaker enclosure.
Few details can be obtained from the part, as there are no chips or other components attached to the board, although it does contain a somewhat different placement of screw holes and a tweaked chip layout. The main A-series chip appears as if it will be slightly larger in area than the A6 seen in the iPhone 5, as it takes up a greater width of the logic board.
Apple's iPhone 5S is expected to launch later this year, perhaps around the September timeframe. Following Apple's pattern of two-year body style cycles, the iPhone 5S will reportedly appear very similar to the iPhone 5 and focus on internal improvements. One differentiating feature may, however, be a fingerprint sensor, which is rumored to be location on or near the device's home button.
Update 8:32 AM: As noted in our forums by chrmjenkins, the logic board may actually be slightly narrower than on the iPhone 5, meaning that the main A-series chip may be the same size as the A6 in the iPhone 5.
I think the logic board has gotten narrower. Notice how the A6 has room for a triple row of caps to its left? The new logic board only has room for a single row (caps being placed longways, granted). Also, the back of the iPhone 5 logic board has the Hynix memory module spanning the whole board. Now since the board is thinner, it's been forced to rotate 90 degrees to fit since it's longer than it is wide.
Sunday December 15, 2024 9:47 am PST by Joe Rossignol
Apple is planning a series of "major design" and "format changes" for iPhones over the next few years, according to The Wall Street Journal's Aaron Tilley and Yang Jie.
The paywalled report published today corroborated the widely-rumored "iPhone 17 Air" with an "ultrathin" design that is thinner than current iPhone models. The report did not mention a specific measurement, but previous...
Monday December 16, 2024 10:06 am PST by Juli Clover
Apple today seeded the first betas of upcoming iOS 18.3 and iPadOS 18.3 updates to developers for testing purposes, with the software coming a week after Apple released iOS 18.2 and iPadOS 18.2.
iOS 18.3 and iPadOS 18.3 can be downloaded from the Settings app on a compatible device by going to General > Software update.
There's no word yet on what's included in iOS 18.3 and iPadOS 18.3, ...
Sunday December 15, 2024 8:43 am PST by Joe Rossignol
Apple is working on a redesigned Magic Mouse that will address some "longstanding complaints," according to Bloomberg's Mark Gurman.
In his Power On newsletter today, Gurman said Apple in recent months has been working on a "full overhaul" of the Magic Mouse with a design that "better fits the modern era." However, he does not expect the new Magic Mouse to be released in the "next 12 to 18...
Sunday December 15, 2024 2:57 pm PST by Joe Rossignol
Apple plans to release a second-generation AirTag next year with "considerably" longer range for item tracking, according to Bloomberg's Mark Gurman.
In his Power On newsletter today, Gurman said the new AirTag will use Apple's second-generation Ultra Wideband chip, or equivalent technology. The chip debuted last year in the iPhone 15 and the Apple Watch Ultra 2, and Apple said it offers up...
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The current Apple TV 4K was released more than two years ago, so the streaming device is becoming due for a hardware upgrade soon. Fortunately, it was recently rumored that a new Apple TV will launch at some point next year.
Below, we recap rumors about the next-generation Apple TV.
Bloomberg's Mark Gurman last week reported that Apple has been working on its own combined Wi-Fi and...
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Apple on Monday seeded the first tvOS 18.3 beta to developers for testing. The update will likely be released in January. So far, there are only minor changes for the Apple TV, with one new feature and a few code changes discovered.
Below, we outline what is new in tvOS 18.3 so far.
Robot Vacuum Support in Home App
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Thursday December 12, 2024 4:36 am PST by Tim Hardwick
Next year's iPhone 17 Pro models will reportedly feature a major redesign, specifically centering around changes to the rear camera module, and now new supply chain information appears to confirm the striking change, according to a Chinese leaker.
iPhone 17 Pro concept render
Late last month, The Information's Wayne Ma claimed that the rear of the iPhone 17 Pro and iPhone 17 Pro...
Weird, I'm sure Apple made improvements in virtually every single aspect of iOS 7 over iOS 6, and I'm also sure I logged into MacRumors, not twitter.
Must be my computer playing up. Restarting now...
Haha amazing to see how many people now seem to care about form over function when usually they're complaining about Apple doing the same thing. For me quick access to common settings and better multitasking > design of app icons.
Lots of possibilities here. Assuming they're moving to 28nm, it definitely means they're adding stuff if it's getting bigger.
Possibilities:
* Rogue family GPU. Die size is unknown for this family so it may well be a reason for increase. * Quad core. Apple may have optimized iOS 7 and its APIs for a true quad core environment. * Shadow core. Apple could be implementing a Tegra-like solution with a simplified, slower core that powers up to take care of simple tasks like notifications. Only when the user is fully using the phone do the faster cores turn on. * big.LITTLE. This is kind of like the shadow core, except it's an actual ARM concept supported directly in their architecture and ISA. Since swift cores are custom, it would be a little different for apple, but it may still be possible for them to use two A7 cores (custom or not) to match their Swift cores for low power operation. It's also possible they've adapted a single A7 core into a shadow core. (*currently ARM's big.LITTLE concept requires the number of A7 cores to match the number of main cores, which is why there is an octa core Samsung Exynos part. Apple may or may not try to break from this restriction) * Custom circuitry. The redesigned A5 for the appleTV had a lot of custom analog circuitry. It's possible Apple could be going even more custom on the A7 design, which could cause a size increase. They could also be moving off component chips on chip to reduce the overall number of components on the board.
All that being said, I think the premise of the article is wrong. I think the logic board has gotten narrower. Notice how the A6 has room for a triple row of caps to its left? The new logic board only has room for a single row (caps being placed longways, granted). Also, the back of the iPhone 5 logic board has the Hynix memory module spanning the whole board. Now since the board is thinner, it's been forced to rotate 90 degrees to fit since it's longer than it is wide.
